EMI, EMC, and Shielding PCB EMC Design Informational

How do I design a split ground plane on a PCB without creating EMI problems?

While a solid, unified ground plane is the modern best practice, some designs require a split ground plane (e.g., separating a high-power digital section from an ultra-sensitive analog or RF section). If a split is necessary, follow these rules to avoid EMI problems: (1) No signal traces may cross the split: any signal trace that crosses the split gap loses its ground return path. The return current must detour around the split, creating a large radiating loop. This is the #1 cause of EMI failures in split-ground designs. Check EVERY signal trace on EVERY layer to verify that none cross the split boundary. This includes traces on inner layers that may be hidden from visual inspection. (2) Bridge the split at one point (star ground): connect the two ground regions at a single, well-defined point. This point should be: at the ADC/DAC or other mixed-signal IC (the IC ground pins bridge the two domains internally; the external bridge should be at the IC location). The bridge width should be 2-5 mm (not a thin trace; a wide bridge provides low impedance). Place decoupling capacitors at the bridge (10 nF + 100 pF) to provide a low-impedance path at high frequencies while maintaining DC isolation if needed. (3) Power must not cross the split either: the power routing for circuits on one side of the split should come from regulators on the same side. If power must cross: use a ferrite bead or inductor to filter the crossing (the ferrite provides high impedance at RF, preventing noise coupling). (4) The split should be on only ONE ground layer: if the PCB has multiple ground planes (e.g., L2 and L4), split only one. Keep the other ground plane solid. This provides a continuous ground return on the unsplit layer for any traces that reference it.
Category: EMI, EMC, and Shielding
Updated: April 2026
Product Tie-In: PCB Materials, Capacitors, Ferrites

Split Ground Design Rules

The split ground is a legacy technique that is occasionally necessary but must be implemented with extreme care to avoid creating more problems than it solves.

Common Questions

Frequently Asked Questions

If splits are bad, why do some datasheets show them?

Many older application notes and datasheets (pre-2005) show split-ground layouts because: (1) that was the best practice at the time (2-layer boards without dedicated ground planes). (2) The application note was written for a specific IC and a simple circuit, where the split was easy to manage. The advice does not scale to complex mixed-signal boards. Modern application notes from ADI, TI, and Maxim now recommend unified ground planes. If you see a split-ground recommendation in a datasheet: check the date of the application note and look for updated guidance. Most manufacturers have revised their recommendations.

How do I handle the ADC clock line in a split-ground design?

The ADC clock is a high-speed digital signal that must reach the ADC (which sits at the bridge between the analog and digital grounds). Route the clock on the digital ground side up to the bridge point (the ADC). The clock return current stays on the digital ground. At the ADC: the clock enters the digital pins, and the ADC internally routes it to drive the sampling circuit. The analog sampling noise is handled by the ADC internal design. Do NOT route the clock on the analog ground side (this would inject digital noise into the analog ground). The clock trace should not cross the split at any point other than through the ADC IC.

Can I use stitching capacitors across the split?

Yes. Placing capacitors across the split gap provides a low-impedance path at high frequencies while maintaining DC isolation. Use 100 pF to 10 nF ceramic capacitors (COG type) placed along the split gap at 10-20 mm intervals. The capacitors short the two ground regions together at RF (> 10 MHz), providing a return path for high-frequency signals. At DC and low frequencies: the capacitors are open circuits, maintaining the DC isolation of the split. This technique provides many of the benefits of a unified ground at RF while maintaining the DC separation of the split. It is the recommended approach when a split is mandated by safety or isolation requirements.

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