How do I route a high speed LVDS signal near an RF circuit without causing interference?
LVDS Routing near RF
LVDS is widely used for camera interfaces (MIPI CSI-2), display interfaces (FPD-Link), and FPGA I/O in mixed-signal products, making proper routing near RF circuits a common design challenge.
- Performance verification: confirm specifications against the application requirements before finalizing the design
- Environmental factors: temperature range, humidity, and vibration affect long-term reliability and parameter drift
- Cost vs. performance: evaluate whether the application demands premium components or standard commercial grades
- Interface compatibility: verify impedance, connector type, and mechanical form factor match the system architecture
- Margin allocation: include sufficient design margin to account for manufacturing tolerances and aging effects
Frequently Asked Questions
Is LVDS always safe near RF?
LVDS is safer than CMOS/TTL (lower swing, differential cancel), but not inherently safe. A 200 MHz LVDS clock has a 10th harmonic at 2.0 GHz (near cellular Band 1). The harmonic level from a well-routed LVDS pair: approximately -60 dBm (before isolation). With 60 dB required isolation to reach -120 dBm at the receiver: 10-25 mm separation + ground plane may be borderline. Always verify with frequency planning and post-layout EMI simulation or measurement.
What about MIPI CSI-2 near RF?
MIPI CSI-2 uses a similar low-voltage differential signaling. Data rates: 1-4.5 Gbps per lane (harmonics extend to 10+ GHz). The lower swing (200 mV) reduces EMI, but the higher data rate creates broadband noise at frequencies that overlap with Wi-Fi 5/6 GHz and 5G FR1. Mitigation: use the MIPI-recommended shield layer in the flex cable, add common-mode filtering at the connector, and route the CSI-2 lanes as far from the RF antenna as possible.
Can I route LVDS and RF on the same layer?
Strongly discouraged. On the same layer: there is no ground plane between the LVDS and RF traces, and the coupling is maximized. Best practice: route LVDS and RF on different layers, separated by a ground plane. If they must be on the same layer: maintain ≥ 25 mm spacing and add a ground trace between them (connected to the ground plane with vias every 2-3 mm).