CPW Impedance (Design)
Setting CPW Impedance With Strip and Gap Geometry
Coplanar waveguide places the signal conductor and both return-current ground planes on the same face of the dielectric, with the electric field crossing the two slots on either side of the center strip. Because those slots dominate the stored energy, the line capacitance and therefore the characteristic impedance depend almost entirely on the in-plane ratio of strip width to slot width. A wide strip with narrow gaps stores more capacitance and produces a low impedance; a narrow strip with wide gaps does the opposite. Practical CPW designs span roughly 20 to 120 Ω, with 50 Ω the near-universal target for connectorized test fixtures and monolithic circuits.
The closed-form solution uses conformal mapping, which transforms the slotted cross-section into a parallel-plate capacitor and yields the impedance as a ratio of complete elliptic integrals K(k)/K(k′). The modulus k is set purely by the geometry, k = a/b where a is the half-strip width and b is the half-spacing to the outer ground edge. Because k carries no thickness term, scaling W and S together leaves the impedance unchanged. The substrate enters only through the effective permittivity, which for a thick substrate approaches the average of the dielectric and air, (εr+1)/2, since the field divides between the two media.
Real designs depart from the ideal in three ways. Finite metal thickness lowers impedance by a few ohms and is corrected with an effective-gap adjustment. Adding a backside conductor creates conductor-backed CPW, which introduces a parallel-plate path that drops impedance and raises effective permittivity. And the finite ground-plane width sets where parasitic slotline and parallel-plate modes appear, so the ground-to-ground spacing must stay below about a tenth of a guided wavelength to keep the line single-moded.
Conformal-Mapping Design Equations
Z0 = (30π / √εeff) × K(k′) / K(k) Ω
Geometry modulus:
k = a / b = W / (W + 2S) and k′ = √(1 − k2)
Effective permittivity (thick substrate):
εeff ≈ (εr + 1) / 2
Where W = center-strip width, S = slot width, a = W/2, b = W/2 + S, K = complete elliptic integral of the first kind, εr = substrate relative permittivity. Example: on alumina (εr = 9.8, εeff ≈ 5.4) a W/S ratio ≈ 2 gives Z0 ≈ 50 Ω.
50 Ohm CPW Geometry by Substrate
| Substrate | εr | εeff | W/S for 50 Ω | Example W / S | Notes |
|---|---|---|---|---|---|
| Alumina | 9.8 | ~5.4 | ~2.0 | 0.50 / 0.25 mm | Thin-film MMIC carriers |
| GaAs | 12.9 | ~7.0 | ~2.3 | 50 / 25 μm | On-wafer probe lines |
| Fused silica | 3.8 | ~2.4 | ~1.2 | 0.30 / 0.25 mm | Low-loss, mmWave |
| RO4350B | 3.66 | ~2.3 | ~1.1 | 1.0 / 0.9 mm | PCB-level CPW |
| Silicon (CB-CPW) | 11.9 | ~6.5 | ~2.6 | 40 / 15 μm | Backing ground lowers Z0 |
Frequently Asked Questions
What strip width and gap give a 50 ohm CPW on alumina?
On 0.635 mm alumina (εr = 9.8) a 50 Ω line lands near a 0.50 mm strip with 0.25 mm gaps, a W/S ratio close to 2. Since impedance follows the ratio, not absolute size, a 0.25 mm strip with 0.125 mm gaps gives the same result. Finite metal thickness and any backing conductor shift it a few ohms, so confirm dimensions in a 2D field solver.
How does CPW impedance change when you add a backside ground plane?
A backside ground turns the line into conductor-backed CPW and adds a parallel-plate capacitance path, so for the same top geometry Z0 drops. To recover 50 Ω you narrow the slots, widen the strip, or thicken the substrate. When the substrate is thicker than about twice the ground-to-ground spacing the backing has little effect; thinner, and the line trends toward microstrip behavior with higher εeff.
Why is CPW impedance nearly independent of substrate thickness?
With the strip and both grounds coplanar, the fields concentrate in the gaps, and the impedance follows the ratio of strip width to slot width through the conformal-mapping factor K(k)/K(k′). That mapping uses only in-plane ratios, so scaling all top dimensions together holds Z0 fixed. This lets you trade conductor loss against size or match a connector pad without re-tuning impedance, which microstrip cannot do.