What is a stacked patch antenna and how does it achieve wider bandwidth than a single patch?
Stacked Patch Antenna Design
The stacked patch is the most widely used wideband patch antenna technique because it maintains the low profile and planar fabrication advantages of the microstrip patch while significantly increasing the bandwidth.
| Parameter | Low Gain | Medium Gain | High Gain |
|---|---|---|---|
| Gain Range | 2-6 dBi | 6-15 dBi | 15-45 dBi |
| Beamwidth | 60-360° | 15-60° | 1-15° |
| Typical Types | Dipole, monopole, patch | Yagi, helical, horn | Parabolic, array, Cassegrain |
| Bandwidth | Narrow to wide | Moderate | Narrow to moderate |
| Complexity | Low | Medium | High |
- Performance verification: confirm specifications against the application requirements before finalizing the design
- Environmental factors: temperature range, humidity, and vibration affect long-term reliability and parameter drift
- Cost vs. performance: evaluate whether the application demands premium components or standard commercial grades
Frequently Asked Questions
Can I stack more than two patches?
Yes: triple-stacked patches (three resonances) achieve 25-40% bandwidth. Quad-stacked: up to 50%+. Each additional patch adds a resonance and extends the bandwidth. However: more layers increase the antenna height, the manufacturing complexity, and the design sensitivity (more parameters to optimize). Triple-stack is the practical limit for most applications.
What about the radiation pattern?
The stacked patch's radiation pattern is similar to a single patch: broadside beam with 6-8 dBi gain, E-plane and H-plane patterns approximately the same as a single patch, and cross-polarization levels similar to a single patch (approximately -20 dB for a well-designed stacked patch). The pattern may degrade slightly at the edges of the bandwidth (where only one patch is resonant), but for most applications: the pattern is acceptable across the full bandwidth.
Is a stacked patch harder to manufacture?
Moderately: the stacked patch requires two substrate layers (driven and parasitic) separated by a spacer (foam, air gap, or a second substrate). PCB fabrication: multi-layer PCB processes handle this well. The parasitic patch can be: a copper layer on a separate PCB bonded to the driven patch's substrate with a foam or prepreg spacer, or a free-standing patch on a foam spacer (for prototyping). The main manufacturing concern: the spacing between patches must be controlled precisely (±0.1 mm) to maintain the designed coupling and bandwidth.