EMI, EMC, and Shielding Shielding and Enclosure Design Informational

How do I design a shielded compartment on a PCB to isolate sensitive RF stages?

A shielded compartment on a PCB (board-level shield or shield can) isolates sensitive RF stages from interference generated by adjacent digital or high-power circuits. Design approach: (1) Shield can: a stamped or drawn metal cover (typically tin-plated steel or nickel-silver alloy, 0.2-0.3 mm thick) that encloses a section of the PCB. The can makes contact with a ground pad perimeter on the PCB surface, creating a miniature Faraday cage. SE: 40-60 dB from 100 MHz to 10+ GHz (limited by the apertures at the PCB edge and any gaps in the ground pad contact). Dimensions: 5-50 mm per side, 2-5 mm height. The can is soldered or clipped to the PCB ground pads. (2) Ground pad perimeter: a continuous copper ring on the top layer of the PCB, connected to the internal ground plane by a dense array of ground vias. The via spacing determines the high-frequency SE: for effective shielding at frequency f, the via spacing must be < lambda/20 at f. At 10 GHz (lambda = 30 mm): via spacing < 1.5 mm. At 2.4 GHz (lambda = 125 mm): via spacing < 6 mm. (3) Via fence: a row of ground vias around the perimeter of the shielded area, connecting the top ground pad to the internal ground planes and the bottom ground plane. This creates a "via cage" that prevents signals from coupling through the PCB dielectric between layers. Via diameter: 0.2-0.3 mm. Via-to-via pitch: 0.5-2 mm depending on frequency. (4) Internal layout: within the shielded compartment: route all RF traces on inner layers (between ground planes) to prevent radiation from the traces. Keep the sensitive components (LNA, VCO, mixer) inside the shield. Route DC bias and control lines through the shield wall using feedthrough capacitors or filtered pins on the shield can.
Category: EMI, EMC, and Shielding
Updated: April 2026
Product Tie-In: Enclosures, Gaskets, Absorbers, Filters

Board-Level RF Shielding

Board-level shielding is essential in modern wireless devices (smartphones, IoT modules, base stations) where RF receivers, transmitters, and digital processors share the same PCB.

Common Questions

Frequently Asked Questions

Do I need a shield can for every RF stage?

Not necessarily. Selective shielding: shield only the stages that are most sensitive (LNA, VCO) or most noisy (PA, synthesizer, digital clock). If two stages are on the same PCB and separated by 20+ mm with a good ground plane: the natural isolation may be sufficient (30-50 dB from ground plane isolation alone). Use a shield can when: (1) The sensitivity of the receiver requires > 50 dB isolation from noise sources. (2) The VCO or synthesizer is susceptible to injection locking from nearby digital clocks. (3) The PA harmonics or spurious emissions must be contained. (4) FCC/CE compliance requires additional isolation beyond the PCB layout and enclosure.

How do I attach the shield can to the PCB?

Three common methods: (1) Solder reflow: the can has a solder-tinned rim that is reflowed to solder paste on the PCB ground pads during the standard SMT reflow process. The can is placed by the pick-and-place machine (for small cans) or manually (for large cans). Best SE (continuous solder bond). (2) Snap-fit (clip-on): the can has spring tabs that snap into slots or holes in the PCB. No soldering required. SE is slightly lower (the spring contact is not as continuous as solder). Easy to remove for rework. (3) Press-fit: the fence posts press into plated through-holes on the PCB. No soldering. Moderate SE. For production: two-piece (soldered fence + clip-on lid) is the most common approach. The fence is permanently soldered for best SE, and the lid is removable for rework and testing.

What about EMI between shield cans?

If two adjacent shield cans share a common ground pad wall: the coupling between them is limited by the via fence quality and the shared ground impedance. If the shared wall has insufficient vias: signals can leak from one compartment to the other through the common ground plane. To maximize inter-compartment isolation: use separate via fences with a gap (no shared wall). Add extra vias in the shared wall region. Ensure the ground planes in the shared wall area are solid (no signal traces crossing the wall). Add an absorber material to the insides of both lids to suppress cavity resonances. Isolation between adjacent well-designed shield cans: 40-70 dB (depending on frequency and via fence quality).

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