SMT

Surface Mount Technology

/ser-fis mount/
Surface mount technology (SMT) is the standard PCB assembly method where components are mounted directly on the board surface rather than through holes. SMT components are smaller, lighter, allow double-sided assembly, and enable automated pick-and-place manufacturing. For RF, SMT packaging reduces parasitic inductance (shorter leads) and enables higher-frequency operation compared to through-hole. Standard SMT packages for RF: 0201, 0402, 0603, QFN, and BGA.
Category: Manufacturing
Related to: PCB, Printed Circuit Board, Connector, Inductor, Capacitor
Units: mm

Understanding SMT for RF

SMT is the dominant assembly technology for RF circuits. The shorter connections and smaller packages reduce parasitic inductance and capacitance, extending the usable frequency range of passive components and improving circuit performance.

SMT Package Sizes

PackageSize (mm)Typical Use
010050.4 x 0.2mmWave passives
02010.6 x 0.3RF passives, DC-40 GHz
04021.0 x 0.5Standard RF, DC-20 GHz
06031.6 x 0.8General RF, DC-6 GHz
QFN3-7 mmMMIC, amplifier ICs
Common Questions

Frequently Asked Questions

What is SMT?

SMT mounts components directly on the PCB surface instead of through holes. Smaller packages, automated assembly, and reduced parasitics enable higher frequency operation. The standard for all modern RF circuit manufacturing.

Why is SMT better for RF than through-hole?

Through-hole leads add 1-3 nH of inductance per pin. At 1 GHz, 1 nH = 6.3 ohms reactance. SMT pads have < 0.1 nH parasitic. This allows SMT components to work at much higher frequencies with less parasitic effects.

What is the smallest practical SMT package for RF?

0201 (0.6x0.3 mm) is standard for production RF circuits to 40 GHz. 01005 (0.4x0.2 mm) is used in the most demanding mmWave applications but requires specialized placement equipment. 0402 is the most common for general RF.

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